| 摘要 |
PROBLEM TO BE SOLVED: To provide an element housing type semiconductor package which excels in moisture resistance without degradating moldability such as flowability and curing characteristics. SOLUTION: An epoxy resin molding material for sealing the element housing type semiconductor package has (A) an epoxy resin, (B) a curing agent, and (C) a metal oxide as the essential components. COPYRIGHT: (C)2003,JPO
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