| 摘要 |
<p>A bonding tool for bonding electronic components by ultrasonic vibration. The bonding tool includes a horn supported by two ribs from both sides, and a transducer is attached to an end of this horn. A protrusion protruding downward from the center between the ribs is provided on the horn, and a tip of the protrusion is a bonding portion which contacts the electronic component. The transducer is driven to apply vertical vibration to the horn. A phase of vertical expansion and compression vibration on the horn generated by this vertical vibration is set to have the same phase as that of bending vibration on the protrusion. Accordingly, displacement by expansion and vertical vibration at side ends of the bonding portion is canceled out by displacement caused by bending vibration.</p> |
