| 摘要 |
PROBLEM TO BE SOLVED: To provide a high purity nickel or nickel alloy target for magnetron sputtering which has a high sputtering efficiency, and can make better the uniformity of film thickness and the ignition properties of plasma even in a production process using a 300 mm wafer, and to provide a production method therefor. SOLUTION: In the high purity nickel or nickel alloy target for magnetron sputtering having excellent uniformity in a sputter film, the permeability of the target is <100. COPYRIGHT: (C)2003,JPO
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