发明名称 COOLER
摘要 PURPOSE: A cooler is provided to improve bond strength by uniformly distributing solder for brazing, to remove air bubbles on the solder by smoothly discharging air heated in brazing, and accordingly to increase tightness. CONSTITUTION: A cooler comprises a step(18b) formed to a base(181) of an outer radiating member to a transition in a predetermined radius and a blocking protrusion(18d) formed at an insertion groove in which an adapter ring(19) is inserted and an inner peripheral surface contacting with the transition. An air vent hole(18e) is formed in the outer radiating member to make an air pocket(18a) exchange air with the outside.
申请公布号 KR20030066144(A) 申请公布日期 2003.08.09
申请号 KR20020006326 申请日期 2002.02.04
申请人 LG ELECTRONICS INC.;SUNPOWER, INC. 发明人 HWANG, DONG GON;UNGER, REUVEN
分类号 F25B9/00;B23K1/00;F25B9/14;(IPC1-7):F25B9/00 主分类号 F25B9/00
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