发明名称 GOLD PLATING SOLUTION AND GOLD PLATING TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a gold plating treatment technique, when the object to be plated having a metallic surface of copper, nickel is subjected to gold plating treatment, by which the elution of these metals can be prevented, and smooth, uniform gold plating can be attained. SOLUTION: A gold plating solution with one or more kinds of mercapto compounds selected from the group consisting of mercaptoacetic acid, mercaptobenzoic acid, thiomalic acid, 2-mercaptobenzothiazole, ammonium thioglycolate, 2-thiouracil and mercaptobenzoimidazole added as metal elution preventing agents in 1 to 1,000 mg/L is used, or those mercapto compounds are adsorbed on the surface in advance, and, after that, gold plating treatment is applied thereto. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003226993(A) 申请公布日期 2003.08.15
申请号 JP20020025681 申请日期 2002.02.01
申请人 ELECTROPLATING ENG OF JAPAN CO 发明人 WACHI HIROSHI
分类号 C23C18/18;C23C18/42;C25D3/48;(IPC1-7):C25D3/48 主分类号 C23C18/18
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