发明名称 |
INTERPOSER FOR A SEMICONDUCTOR MODULE, SEMICONDUCTOR PRODUCED USING SUCH AN INTERPOSER AND METHOD FOR PRODUCING SUCH AN INTERPOSER |
摘要 |
<p>The intermediate carrier has a flat carrier body (10) with its upper surface provided with inner terminals (22) for contacting terminal elements (21) of a semiconductor component (2) and its lower surface provided with outer terminals (18) for contacting a circuit board, conductive connections between the opposite surfaces provided via metallized throughbores. The walls of the throughbores are partially exposed by adjacent recesses (14,16) in the lower surface of the carrier body, for providing freely projecting studs (15,17) acting as the outer terminals. Also included are Independent claims for the following: (a) a semiconductor module with an intermediate carrier; (b) a manufacturing method for an intermediate carrier for a semiconductor module</p> |
申请公布号 |
EP1340255(A2) |
申请公布日期 |
2003.09.03 |
申请号 |
EP20010999000 |
申请日期 |
2001.11.15 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
HEERMAN, MARCEL |
分类号 |
H01L23/32;H01L23/13;H01L23/498;H05K1/02;H05K3/34;(IPC1-7):H01L23/13 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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