| 摘要 |
PROBLEM TO BE SOLVED: To provide a package that is simply and easily assembled by reducing the number of parts, copes with high frequency, and can acquire an optical semiconductor module of superior heat release characteristic. SOLUTION: Related to a package 10 for optical semiconductor module, a frame 11 and a base 13 are integrally formed by a MIM (Metal Injection Molding) method or a CIM (Ceramic Injection Molding) method. A notch 13a is formed at a part of the base 13 acting as a bottom plate. A substrate 14 is joined to the notch 13a. The substrate 14 comprises an upper substrate 14a, a lower substrate 14b and a number of Peltier elements arrayed between the upper and lower substrates 14a and 14b. Thereby heat generated at a semiconductor laser is promptly released to the outside of a system through the Peltier elements 14c. COPYRIGHT: (C)2003,JPO
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