发明名称 PLATING METHOD AND PLATED GOODS
摘要 PROBLEM TO BE SOLVED: To provide plated goods having a fine structure and a plating method capable of surely manufacturing the plated goods. SOLUTION: The plating method has a step of forming an aluminum layer 9 on the surface of a base material 8, a step of forming a high melting point material layer 4 composed of a material which permits the removal by dry etching and has a melting point above 1,600°C on the surface of the aluminum layer 3, a step of forming a silicon layer 5 on the surface of the high melting point material layer 4, a step of forming a resist layer 6 on the surface of the silicon layer 5, a step of forming resist patterns by removing portions of the resist layer 6, a step of removing the silicon layer 5 and the high melting point material layer 4 of the segments where the resist layer 6 is removed by dry etching, and a step of forming a plating layer 7 composed of a metallic material in at least the segments where the silicon layer 5 and the high melting point material layer 4 are removed. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003277980(A) 申请公布日期 2003.10.02
申请号 JP20020079809 申请日期 2002.03.20
申请人 SEIKO EPSON CORP 发明人 KAYANO YUJI;KOEDA SHUJI
分类号 B41J2/16;C23C14/14;C25D1/00;C25D5/02;C25D5/40;C25D7/00;(IPC1-7):C25D7/00 主分类号 B41J2/16
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