发明名称 PACKAGE FOR OPTICAL SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To improve the heat radiating property of a package for an optical semiconductor. SOLUTION: In the package of the optical semiconductor, a supporting body 16 is electrically insulated from a lead plate 12 by an insulating material 13 while the lead plate 12 and the insulating material 13 form a hierarchical structure and lead plates for every stages are independent. The lead plate is constituted of Fe or a material whose principal constituent is Fe. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003283037(A) 申请公布日期 2003.10.03
申请号 JP20020079951 申请日期 2002.03.22
申请人 NICHIA CHEM IND LTD 发明人 MURAYAMA TAKASHI;SANO MASAHIKO
分类号 H01S5/024;(IPC1-7):H01S5/024 主分类号 H01S5/024
代理机构 代理人
主权项
地址