| 摘要 |
PROBLEM TO BE SOLVED: To obtain a surface treated material which maintains solderability, whisker resistance and heat resistant reliability as a plating material and good moldability. SOLUTION: An Ni or Ni alloy layer 12 having a thickness of 0.05 to 1.0μm is formed on the surface of copper or a copper alloy 10 and an Sn or Sn alloy layer 16 is formed on the extreme surface side. Diffusion layers essentially consisting of Cu and Sn or diffusion layers 14 (18) essentially consisting of Cu, Ni and Sn are formed in≥1 layers between the Ni or Ni alloy layer 12 and the Sn or Sn alloy layer 16 and the thickness of the diffusion layers 14 (18) contacting with the Sn or Sn alloy layer 16 among the diffusion layers is 0.2 to 20μm and the Cu content thereof is≤50 wt.% and the Ni content thereof is≤20 wt.%. COPYRIGHT: (C)2004,JPO
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