| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition giving such semiconductor devices that make less resistance against being cut off and separated from each other, when the devices are produced after integrally sealing semiconductor elements having metal frames by using the composition, therefore are easily separated from each other, and make cutter blades less abraded, and to provide the semiconductor device by using the composition. SOLUTION: This epoxy resin composition contains (A) at least one kind of epoxy resin selected from phenol aralkyl-type epoxy resins (having a phenylene skeletal structure, a biphenylene skeletal structure, etc.), and naphtol aralkyl-type epoxy resins (having a phenylene skeletal structure), (B) at least one kind of phenol resin selected from phenol aralkyl resins (having a phenylene skeletal structure, a biphenylene skeletal structure, etc.), and naphtol aralkyl resins (having a phenylene skeletal structure) (C) an accelerator, (D) a metal hydroxide containing 20 wt.% or more crystallization water and/or a metal hydroxide solid solution containing 20 wt.% or more crystallization water in an amount of 0.5-30 wt.% based on the total weight of the composition, and (E) another inorganic filler as essential ingredients. COPYRIGHT: (C)2004,JPO
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