| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for curing a heat-curable epoxy resin composition which is excellent in heat resistance, flexibility, etc., and used for an adhesive, a coating material, an electric material-sealing medium, a photo-semiconductive material-sealing medium, a printed-wiring board or an electrical insulating layer of the board. SOLUTION: This method for curing the epoxy resin composition comprises curing the composition under a prescribed condition of two or more stages, wherein the epoxy resin composition comprises (A) an epoxy resin composed of (a) a cycloaliphatic epoxy compound and (b) another epoxy compound which is added when necessary, (B) a compound which is added when necessary and reacts with a cation species, and (C) a compound which forms the cation species by heating. COPYRIGHT: (C)2004,JPO
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