| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device with a semiconductor chip being laminated and bonded on a semiconductor wafer, which can suppress a length of a burr protruding around the semiconductor chip and inhibit positional deviation of electrodes from each other.SOLUTION: A semiconductor device manufacturing method comprises: a temporary adhesion process of laminating on a semiconductor wafer via an adhesive film 1, a semiconductor chip 2 with a through electrode having a solder layer; and an electrode bonding process of heating the semiconductor chip temporarily adhered on the semiconductor wafer to a temperature above a solder melting temperature to bond the through electrode having the solder layer of the semiconductor chip and the electrode on the semiconductor wafer. The adhesive film has a modulus of elasticity in shear of not less than 0.2 MPa and less than 20 MPa and is preliminarily supplied to the semiconductor chip or the semiconductor wafer. When assuming that a height of an electrode on the side where the adhesive film is supplied is A and a height of an electrode on the side where the adhesive film is not supplied is B, and a thickness of the adhesive film is X, the following formula (1) is satisfied: 0.50<B/(X-A)≤0.80 (1).SELECTED DRAWING: Figure 1 |
