| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing equipment and a method of manufacturing semiconductor element. SOLUTION: In a wafer chuck 101 that fixes a semiconductor wafer on which a predetermined thin film is deposited and a process chamber 100 where etching gas is injected to the semiconductor wafer 102, a guide ring is formed at the edge of the semiconductor wafer 102 using a clamp 104 and a shadow ring, which are installed at the edge of the semiconductor wafer 102 fixed on the wafer chuck 101 and prevent the edge from being etched, thus not only preventing the phenomenon of the edge of pattern being over-polished during a succeeding CMP process, but also improving the reliability and the productivity of semiconductor element. COPYRIGHT: (C)2004,JPO
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