| 发明名称 |
Semiconductor package |
| 摘要 |
A semiconductor package, containing two or more stacked IC devices attached to a substrate. Each of the IC devices has a plurality of electrical contact regions which are connected to the substrate by means of electrical connections.
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| 申请公布号 |
US2003197284(A1) |
申请公布日期 |
2003.10.23 |
| 申请号 |
US20030361814 |
申请日期 |
2003.02.11 |
| 申请人 |
UNITED TEST & ASSEMBLY CENTER LIMITED |
发明人 |
KHIANG WANG CHUEN;CHUAN KOH YONG;CHIN FONG KOK |
| 分类号 |
H01L23/31;H01L25/065;(IPC1-7):H01L23/48;H01L29/40 |
主分类号 |
H01L23/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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