发明名称 PLATING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To uniformly and surely form a plated layer up to the deep bottom of a fine recessed part. SOLUTION: In a plating method, a nozzle housing having an injection nozzle capable of injecting a liquid is provided, and the nozzle housing accommodating a plating material is arranged in such a manner that the liquid injected into a plating tank from the injection nozzle collides with a material to be plated, which is accommodated in the plating tank. Thereafter, the plating liquid is supplied into the nozzle housing under pressure while connecting the plating material and the material to be plated to an electric source. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003342783(A) 申请公布日期 2003.12.03
申请号 JP20020153808 申请日期 2002.05.28
申请人 MICRONICS JAPAN CO LTD 发明人 TANDAI TAKAHIKO;HAGA ICHIRO;HIRAKAWA HIDEKI
分类号 C25D5/08;C25D5/02;C25D7/00;H01L21/288;(IPC1-7):C25D5/08 主分类号 C25D5/08
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