发明名称 HIGH-MOLECULAR WEIGHT EPOXY RESIN, RESIN COMPOSITION FOR ELECTRICAL LAMINATE, AND ELECTRICAL LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a high-molecular weight epoxy resin excellent in flexibility, heat resistance, low water absorbency, electrical characteristics and moldability, a composition for an electrical laminate, and an electrical laminate. SOLUTION: The high-molecular weight epoxy resin is represented by general formula (1) äwherein A is a chemical structure represented by general formula (2) or (3), with the A of general formula (3) accounting for at least 5 mol% of the epoxy resin of general formula (1); B is H or a group represented by general formula (4); and n is 25 to 500 on average} and has a weight-average molecular weight of 10,000 to 200,000. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003342350(A) 申请公布日期 2003.12.03
申请号 JP20020157044 申请日期 2002.05.30
申请人 JAPAN EPOXY RESIN KK 发明人 HIRAI TAKAYOSHI;IMURA TETSURO
分类号 C08G59/14;C08G59/20;H05K1/03;(IPC1-7):C08G59/14 主分类号 C08G59/14
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