发明名称 Contact assembly for land grid array interposer or electrical connector
摘要 The present invention provides an electrical contact comprising a first member having spring properties and a second member wrapped around at least a portion of the first member wherein the second member has a greater electrical conductivity than the first member. In one embodiment, a conductor is wrapped around at least a portion of a spring. In another embodiment, the spring is formed into a coil or helix with a wire wrapped around at least a portion of the helical spring. In one form of this embodiment, the spring has a plurality of turns and the wire is wrapped around at least two of the turns. In another form of this embodiment, the spring has a plurality of turns and the wire is wrapped around all of the turns. An interposer connector is also provided having a frame including a top surface and a bottom surface and a plurality of apertures arranged in a pattern and opening onto the top and bottom surfaces of the frame. A plurality of springs are provided with each spring having a conductor wrapped around at least a portion of the spring where the conductor has a greater electrical conductivity than the spring. One of the springs is positioned within each of the apertures so that at least a portion of each of the conductors is exposed above the top and bottom surfaces of the frame.
申请公布号 US6659778(B2) 申请公布日期 2003.12.09
申请号 US20020210300 申请日期 2002.08.01
申请人 HIGH CONNECTION DENSITY, INC 发明人 LI CHE-YU
分类号 H01L23/32;H01R12/00;H01R13/24;(IPC1-7):H01R12/00 主分类号 H01L23/32
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