发明名称 |
Wiring board utilizing a conductive member having a reduced thickness |
摘要 |
In a wiring board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principal plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate.
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申请公布号 |
US6670718(B2) |
申请公布日期 |
2003.12.30 |
申请号 |
US20010021257 |
申请日期 |
2001.12.19 |
申请人 |
HITACHI CABLE, LTD. |
发明人 |
CHINDA AKIRA;MATSUURA AKIRA |
分类号 |
H01L23/12;H01L23/498;H05K1/11;H05K3/24;H05K3/34;H05K3/40;(IPC1-7):H01L23/48;H01L23/02 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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