发明名称 Wiring board utilizing a conductive member having a reduced thickness
摘要 In a wiring board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principal plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate.
申请公布号 US6670718(B2) 申请公布日期 2003.12.30
申请号 US20010021257 申请日期 2001.12.19
申请人 HITACHI CABLE, LTD. 发明人 CHINDA AKIRA;MATSUURA AKIRA
分类号 H01L23/12;H01L23/498;H05K1/11;H05K3/24;H05K3/34;H05K3/40;(IPC1-7):H01L23/48;H01L23/02 主分类号 H01L23/12
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