| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape cutting and compressively bonding apparatus capable of sticking accurately each tape piece to a predetermined position present on a lead frame or a plastic board. SOLUTION: The cutting and compressively bonding apparatus has a tape cutting mechanism for cutting a tape 14 exhibiting adhesiveness by heating into tape pieces 14a each having a constant length, a tape holder 5 capable of sucking and holding each tape piece 14a simultaneously with cutting, a compressively bonding mechanism for holding and heating a lead frame or a plastic board 10 so as to bond compressively each tape piece thereto, a carrying mechanism capable of making the tape holder 5 reciprocate between a position having the tape cutting mechanism and a position having the tape compressively bonding mechanism, a guide roller 16 capable of positioning the tape holder 5 accurately in the case of cutting each tape piece 14a so as to lower the tape holder 5, and stoppers 9, 9a capable of stopping in a predetermined position the tape holder 5 for sucking, holding and raising each cut tape piece 14a. COPYRIGHT: (C)2004,JPO |
