发明名称 HEAT-DISSIPATING MATERIAL WITH HIGH THERMAL CONDUCTIVITY AND ITS MANUFACTURING PROCESS
摘要 PROBLEM TO BE SOLVED: To obtain a heat-dissipating material with a high thermal conductivity, a low coefficient of thermal expansion and an excellent workability. SOLUTION: The heat-dissipating material 10 has a structure equipped with two or more carbon nanotubes 11, a metal carbide 12 and a matrix metal 13, wherein the metal carbide 12 is present at the surface of the carbon nanotubes 11. The carbon nanotubes 11 are one- or two-dimensionally oriented in a fixed direction within the matrix metal 13 and are contained at≥14 vol.%. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004010978(A) 申请公布日期 2004.01.15
申请号 JP20020166954 申请日期 2002.06.07
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KAWAI CHIHIRO
分类号 C22C32/00;B22F3/14;C22C49/14;H01L23/373;(IPC1-7):C22C32/00 主分类号 C22C32/00
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