| 发明名称 |
METHOD FOR PACKAGING AN ORGANIC LIGHT EMITTING DIODE AND A DISPLAY DEVICE USING THE SAME |
| 摘要 |
The present invention discloses a method for packaging an organic light emitting diode: allocating a position for attaching a glass cloth tape on the packaging substrate; attaching the glass cloth tape on the position; bonding an organic light emitting diode substrate to the packaging substrate; melting the glass cloth tape, so that the organic light emitting diode substrate welds together with the packaging substrate. The present invention can avoid the presence of a welding gap, so that external gas cannot enter into an internal part of the packaging body, thereby increasing the service life of the OLED device. |
| 申请公布号 |
US2016380228(A1) |
申请公布日期 |
2016.12.29 |
| 申请号 |
US201514774133 |
申请日期 |
2015.06.29 |
| 申请人 |
Shenzhen China Star Optoelectronics Technology Co., Ltd. |
发明人 |
YANG Qingdou;LIU Yawei |
| 分类号 |
H01L51/52;H01L27/32;H01L51/56 |
主分类号 |
H01L51/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for packaging an organic light emitting diode, comprising:
providing a packaging substrate; allocating a position for attaching a glass cloth tape on the packaging substrate; attaching the glass cloth tape on the position; and bonding an organic light emitting diode substrate to the packaging substrate, wherein the organic light emitting diode substrate has the organic light emitting diode disposed thereon; welding the organic light emitting diode substrate and the packaging substrate together by using a laser to melt the glass cloth tape. |
| 地址 |
Shenzhen CN |
