| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device with its thickness reducible without degrading mechanical strength in semiconductor element, and to provide a holder for mounting semiconductor elements in manufacturing of the semiconductor device. <P>SOLUTION: Board-side electrodes 2a on the surface of a wiring board 2 and element-side electrodes 3a on the surface of a semiconductor element 3 face each other. A hardened ACF (anisotropic conductive film) 7 filling up the gap between the wiring board 2 and the semiconductor element 3 covers the sides 3d of the semiconductor element 3, with its top surface 7a is so adjusted as to be flush with the rear surface 3c of the semiconductor element 3. A holder 4, which holds the semiconductor element 3 in the process of mounting the semiconductor element 3 on the wiring board 2, is so designed that it is wider than the semiconductor element 3 and that its surface to abut at the semiconductor element 3 is coated with a releasing agent 4c for preventing the adhesion of resin adhesive. <P>COPYRIGHT: (C)2004,JPO</p> |
