| 摘要 |
PROBLEM TO BE SOLVED: To provide an exposure method that can be used to prevent accumulation of process errors in a substrate treated by a multi-treatment compatible device and to manufacture a high-quality semiconductor device. SOLUTION: In a semiconductor integrated circuit manufacturing line 1, a wafer for each lot is polished at a unit of two pieces in sequence by first and second processing systems 21 and 22 of a CMP apparatus 20. An information on wafer showing which processing system of the first and second processing systems 21 and 22 processes the wafer is transmitted to the following processing device including an aligner 10 through a communication line 40. The respective wafer input to the aligner 10 is allocated to a plurality of processing stems of the aligner 10 so that the wafer processed by the same processing system of the CMP apparatus 20 may be processed by either of two processing systems 11 and 12 of the aligner 10, and the wafer is subjected to exposure in the respective processing system. COPYRIGHT: (C)2004,JPO |
