发明名称 PASTED BASE BOARD CUTTING SYSTEM AND BASE BOARD CUTTING METHOD
摘要 <p>A cutting apparatus 400 has a first cutting device 410 located so as to face a first substrate and a second cutting device 420 located so as to face the second substrate. A cutting unit 411 includes a cutter wheel 412 for forming scribing lines on the first substrate and a breaking roller 416 which let the scribing lines penetrate through the thickness direction of the first substrate. The second cutting device 430 also includes a cutter wheel 412 for forming scribing lines on the second substrate and a breaking roller 416 which let the scribing lines penetrate through the thickness direction of the second substrate. The first cutting device 410 includes a back up roller 414 which opposes the breaking roller 416 of the second cutting device 430 and is pressed onto a surface of the first substrate. The second cutting device 430 also has a similar back up roller. <IMAGE></p>
申请公布号 AU2003246250(A1) 申请公布日期 2004.02.02
申请号 AU20030246250 申请日期 2003.07.02
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO.,LTD. 发明人 YASUTOMO OKAJIMA;YOSHITAKA NISHIO
分类号 B28D5/00;B65G49/06;C03B33/02;C03B33/027;C03B33/03;C03B33/033;C03B33/07;(IPC1-7):B28D5/00 主分类号 B28D5/00
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