| 摘要 |
PROBLEM TO BE SOLVED: To provide a general-purpose package for a semiconductor chip which is capable of reducing the production cost of a custom-made semiconductor device. SOLUTION: The general-purpose package is formed of synthetic resin integrally molded together with a metal plate 20; and equipped with a main body 11 that is composed of a bottom plate where the metal plate 20 is exposed on its top surface and a frame 13 around the bottom plate, and leads 30 that are fixed as penetrating through the frame 13 of the main body 11. The metal plate 20 is large enough in size for mounting any of semiconductor bare chips 50, 60, and 70. Pads of the mounted semiconductor bare chip and inner leads 31 are connected together with bonding wires. COPYRIGHT: (C)2004,JPO
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