| 摘要 |
PROBLEM TO BE SOLVED: To provide a core substrate where wiring density is improved by microfabricating a wiring pattern of signal lines, etc. to be formed in a wiring layer in a built-up high-density printed board, and to provide a high-density printed board using the core substrate. SOLUTION: In the built-up high-density printed board using the core substrate, the core substrate has structure in which respective wiring layers formed on a plurality of layers on both surfaces of the core substrate are electrically connected via a via through hole or a through hole, and has structure of completely burying insulating resin into the inner wall of the through hole, forming a plurality of circuits in the through hole, and forming the circuits with the same line width as the wiring width of the signal line to electrically connect through the circuits. COPYRIGHT: (C)2004,JPO |
