发明名称 THERMOPLASTIC RESIN COMPOSITION FOR HIGH FREQUENCY AND MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition for high frequency which can obtain a molded article having a high dielectric constant, a small dielectric dissipation factor, and a small temperature coefficient of the dielectric constant in the high frequency region of≥1GHz. SOLUTION: The thermoplastic resin composition for high frequency comprises a thermoplastic resin composed of at least one of a styrenic polymer mainly having a syndiotactic structure and a liquid crystal polymer resin, at least one inorganic filler to be selected from titania, magnesium titanate, strontium titanate, calcium titanate, and alumina, and an oxidizing agent-soluble inorganic filler. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004059702(A) 申请公布日期 2004.02.26
申请号 JP20020218828 申请日期 2002.07.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 YAMAMOTO HIROSHI;OTSU MASAAKI
分类号 C08J5/00;B29C45/14;B29K25/00;B29K105/16;C08K3/00;C08K7/08;C08K9/02;C08K9/04;C08L25/00;C08L67/04;C08L101/12;(IPC1-7):C08L25/00 主分类号 C08J5/00
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