| 摘要 |
PROBLEM TO BE SOLVED: To fix a heat sink and a retention module at the same time. SOLUTION: The heat sink 4 is provided with a plurality of thin and long projecting pins 8 on the bottom of a heat sink body 15. A revet having a through hole 22 in the lengthwise direction is inserted into a hole 18 on the bottom of the retention module 6, and the heat sink 4 and the retention module 6 are pressed downward at the same time, thus inserting the revet 7 into a hole 20 corresponding to a substrate 1, as well as the pins 8 into the corresponding through hole 22 of the rivet 7. As a result, locking of the retention module 6 to the substrate 1, fixation of the heat sink 4 and contact of the bottom 24 of the heat sink 4 with an integrated circuit can be realized at the same time. COPYRIGHT: (C)2004,JPO |
