| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric cooling apparatus in which a heating part of an electronic component of a high heat generating density to be cooled is efficiently cooled. SOLUTION: Heat of a heating part 9 is diffused by a heat flux converter 8 having a heat propagation area larger than the heating part 9. The heat flux converter 8 and a thermoelectric cooling module 1 are located face to face, and an electric current is made to flow to a thermoelectric transducer 5 provided between first and second substrates 6 and 7 of the thermoelectric cooling module 1 to absorb heat diffused by the heat flux converter 8 with the second substrate 7 as a heat absorption side substrate. The heat is radiated from the first substrate 6 of the thermoelectric cooling module 1 and further, the heat is radiated by a heat sink 3. A maximum heat absorption of the thermoelectric cooling module 1 is made 2.5 times or more of a required heat absorption (required heat absorption / maximum heat absorption is 40% or less), and an exchange area of heat of the heat flux converter 8 on the side of the thermoelectric cooling module 1 is made approximately equal with a heat exchange area of the thermoelectric cooling module 1 on the side of the heat flux converter 8 (approximately from 80% to 120%). COPYRIGHT: (C)2004,JPO |
