发明名称 Memory device structure with composite buried and raised bit line
摘要 The present invention provides a memory structure, comprising: a substrate; a gate oxide layer disposed on a portion of the substrate; a gate structure disposed on the gate oxide layer; a buried bit line disposed in the substrate along both sides of the gate structures; a raised line disposed on the burled bit line; an isolating spacer disposed on both sidewalls of the gate structure and a word line disposed over the substrate in a direction perpendicular to the buried bit line; and an insulation layer disposed on a top of the raised line to electrically isolate the raised line and the word line.
申请公布号 US6710381(B1) 申请公布日期 2004.03.23
申请号 US20020065355 申请日期 2002.10.08
申请人 MACRONIX INTERNATIONAL CO., LTD. 发明人 HUANG WENG-HSING;CHANG KENT KUOHUA
分类号 H01L21/8239;H01L27/105;H01L27/115;(IPC1-7):H01L29/749 主分类号 H01L21/8239
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