| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for making a silicon device and a method for making a liquid jet head unerringly preventing a breakage of a piezoelectric device during manufacturing. SOLUTION: The silicon device is manufactured by forming a first steam permeation prevention pattern 130 by forming a first moisture permeation prevention layer 96 that is the same layer as a first conducting layer 96 and continuous as if to surround the entire thin film pattern of the silicon wafer 100 on a silicon wafer 100, forming a second moisture permeation prevention layer 114 that is the same layer as an insulating layer 110 and narrower than the first moisture permeation prevention layer 96 on the first moisture permeation prevention layer 96 and forming a third moisture permeation prevention layer 121 that is the same layer as a second conducting layer 120 and as if to cover the second moisture permeation prevention layer 114 on the second moisture permeation prevention layer 114, and subsequently, joining a sealing substrate to the silicon wafer 100 through the moisture permeation prevention pattern 130 and a recess by etching from the other side of the silicon wafer 100 when the thin film pattern is formed on one side of the silicon wafer 100. COPYRIGHT: (C)2004,JPO |
