| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thick film multilayer substrate manufacturing method capable of reducing the aperture size of a via hole without increasing manufacturing costs. <P>SOLUTION: An unburned thick film insulator sheet (raw sheet) 54 on which a conductive printing layer 84 is formed and conductive paste is applied to the insides of via holes 28, 30 is laminated on a substrate 12, bonded by thermocompression bonding and then burned. However, the via holes 28, 30 formed by punching work can be reduced at its aperture size because the area of the aperture is not reduced in printing. Since the raw sheet 54 is bonded by thermocompression in the case of burning, contraction of the raw sheet 54 in the surface direction can be interrupted by the substrate 12. Consequently, positional deviations of wiring patterns 46, 40, via holes 28, 30, etc. due to large contraction in the face direction can be prevented without adding a specific process, so that mutual intervals between respective parts can be shortened. <P>COPYRIGHT: (C)2004,JPO</p> |
