SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive TCP and FPC capable of facilitating countermeasures to multiple pin arrangement and narrow pitch structure by a conventional facility, and to realize its manufacturing method. SOLUTION: An exclusive connecting terminal is arranged like a land-shaped stage or lattice for improving peel strength, and connecting land outline dimension width is set as a testable land size so that the dual use of a test terminal and the connecting terminal can be realized. COPYRIGHT: (C)2004,JPO