| 摘要 |
PROBLEM TO BE SOLVED: To efficiently prevent cracks in a molded resin part of a resin injected piece 20 that is formed by cutting a resin injected substrate 8 as necessary wherein a plurality of semiconductor chips 3 are inetgerally mounted by means of a bump 4 to form a substrate 5. SOLUTION: While the respective semiconductor chips 3 mounted on the substrate 5 are respectively covered with a resin member 11, the substrate 5 is supplied to both molds 1 and 2 and they are mold-clamped to adhere the resin member 11 to the top surface 14 and the side surface of the semiconductor chip 3 efficiently and without producing any clearance. Then, a melted resin is put into the cavity 10, and the melted resin is put into at least a clearance 6 between the substrate 5 and the semiconductor chip 3, to form a clearance resin part A (molded resin part 21), thereby molding the resin injected substrate 8. COPYRIGHT: (C)2004,JPO |
