发明名称 METHOD AND APPARATUS FOR HOLDING SUBSTRATE, AND ALIGNER
摘要 PROBLEM TO BE SOLVED: To provide a method and apparatus for holding a substrate, in which dislocation that occurs at picking up is small, with a stable amount of dislocation. SOLUTION: The substrate holding apparatus comprises a support member 10, which supports a substrate from below by three or more points (support points). The support member comprises a post 11, extending vertically, a cross bar 13 extending laterally from the tip of the post, and a rubber ring 15 fitted in the cross bar. Since the substrate contacts by a single point at the top of the rubber ring 15, when it is vertically disposed so that the outer peripheral surface of the ring becomes convex, no space is formed between the substrate and the rubber ring, causing no suction phenomenon. So, no vibration or dislocation takes place, when the substrate is removed. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004111685(A) 申请公布日期 2004.04.08
申请号 JP20020272842 申请日期 2002.09.19
申请人 SENDAI NIKON:KK;NIKON CORP 发明人 KIKUCHI HIDEKAZU
分类号 H01L21/683;G03F7/20;H01J37/20;H01L21/027;H01L21/687;(IPC1-7):H01L21/68 主分类号 H01L21/683
代理机构 代理人
主权项
地址