| 摘要 |
PROBLEM TO BE SOLVED: To change the pinched position of a substrate while the substrate is rotated. SOLUTION: A spin chuck 1 rotates around a rotating shaft 25 while the chuck 1 pinches a wafer W by means of a pinching member F1. In the spin base 21 of the chuck 1, an operation converting mechanism FT1 which converts the operation of an elevating/lowering member 46 into the operation of the pinching member F1 is provided. When a motor M1 is driven, a ball-screw mechanism 61 is driven through gears 54 and 66 and a ball nut 64 is moved vertically. The driving force caused by the vertical movement of the nut 64 is transmitted to the elevating/lowering member 46 through a nonrotating-side mobile member 68, a bearing 71, and a rotating-side mobile member 81. Therefore, the pinched state of the wafer W can be relieved or canceled by operating the pinching member F1 even in the course of rotating the spin chuck 1. COPYRIGHT: (C)2004,JPO |
