发明名称 |
MOLD FOR MICROCOMPONENT AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a mold for a microcomponent, which reduces manufacturing costs and has high accuracy and wherein a hardness of a surface layer is high, and a manufacturing method therefor. SOLUTION: This mold 10 for the microcomponent is composed of plated metal in which a hard coating 11 is formed at least as the surface layer. The hard coating 11 has a skewed distribution composition. The hard coating 11 is composed of a titanium film including titanium nitride, and the concentration of the titanium nitride is gradually decreased inward from the surface layer of the coating 11. In this manufacturing method for the mold 10, a surface of a silicon substrate 20 is worked; an original mold for the mold 10 is prepared; the coating 11 is formed on the surface of the original mold; an electroless-plating metallic layer 13 and/or an electrolytic-plating metallic layer 14 are/is formed on the surface of the coating 11 by electroless plating and/or electrolytic plating; the metallic layer 13 and/or the metallic layer 14 and the coating 11 are brought into close contact with one another; and the original mold for the mold 10 is transferred to the metallic layer 13 and/or the metallic layer 14. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004106341(A) |
申请公布日期 |
2004.04.08 |
申请号 |
JP20020271637 |
申请日期 |
2002.09.18 |
申请人 |
MIHARA YUTAKA;HASHIGUCHI GEN;OHIRA FUMIKAZU;YOSHIMURA HIDENORI;ADVANEX INC;AOI ELECTRONICS CO LTD |
发明人 |
OGAWA ATSUSHI;MIHARA YUTAKA;HASHIGUCHI GEN;OHIRA FUMIKAZU;YOSHIMURA HIDENORI;CHIKASHIGE KIYOSHI |
分类号 |
B29C33/38;(IPC1-7):B29C33/38 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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