发明名称 |
STAMPING FOIL COMPRISING POLYAMIDE COPOLYMER RESIN IN ADHESIVE LAYER AND PREPARATION METHOD THEREOF |
摘要 |
PURPOSE: A stamping foil comprising the polyamide copolymer resin in an adhesive layer and a preparation method thereof are provided to have the good adhesive property and cutting property when stamping to the adhered material such as an ink coating paper. CONSTITUTION: The stamping foil comprising the polyamide copolymer resin in an adhesive layer has a base film(1), a release layer(2), a color layer(3), a deposition layer(4) and an adhesive layer(5), wherein the adhesive layer comprises a polyamide copolymer resin, the polyamide copolymer resin has the glass transition temperature of 0 to 40 deg.C and the thickness of the adhesive layer is 0.5 to 1.5 micrometers.
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申请公布号 |
KR20040032231(A) |
申请公布日期 |
2004.04.17 |
申请号 |
KR20020061160 |
申请日期 |
2002.10.08 |
申请人 |
KOLON IND. INC./KR |
发明人 |
CHOI, SEONG HO;PARK, HO JIN;PARK, JONG MIN;YOON, GYEONG GEUN |
分类号 |
B41M5/00;B44C1/17;C09J7/02;(IPC1-7):B41M5/00 |
主分类号 |
B41M5/00 |
代理机构 |
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主权项 |
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地址 |
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