Tray for aligning semiconductor packages and test handler using the same, and method of aligning semiconductor packages and test method using the same

摘要

A tray for aligning semiconductor packages, a test handler using the same, a method of aligning the semiconductor packages, and a test method using the same include a tray main body comprising a plurality of package pocket portions at which a plurality of semiconductor packages are individually received and an air position-aligning unit coupled to the tray main body. The air position-aligning unit applies air having a preset pressure to the semiconductor package received at the package pocket portion. The semiconductor package is aligned at the package pocket portion.

主权项

1. A tray for aligning semiconductor packages, the tray comprising:
a tray main body comprising a plurality of package pocket portions at which a plurality of semiconductor packages are individually received; and an air position-aligning unit coupled to each of the plurality of package pocket portions of the tray main body, the air position-aligning unit applying air having a preset pressure to a semiconductor package of the plurality of semiconductor packages received at a package pocket portion of the plurality of package pocket portions, wherein the semiconductor package is aligned at the package pocket portion by the application of air by the air position-aligning unit directly to the semiconductor package in the package pocket portion.