| 摘要 |
PROBLEM TO BE SOLVED: To decrease sealing processes for a lead cut hole that is for cutting a lead wire for plating formed as to an electrically neutral specified inner lead, for example, among inner leads provided to a TCP. SOLUTION: A flexible substrate 10A has a chip component 30 arranged in a device hole 20 having a number of inner leads having been plated and is provided with a sealing resin 40 from the circumference of the chip component 30 to the circumferential edge of the device hole 20, and also provided with the lead cut hole H that cuts a lead wire for plating formed to plate the specified inner lead. The plating lead cut hole H is formed in a coating area of the sealing resin 40 at the circumferential edge of the device hole 20. COPYRIGHT: (C)2004,JPO
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