| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device that can suppress the deterioration of the quality of waveform caused by the reflection of signals at the time of connecting differential lines between different layers in a multilayered substrate. SOLUTION: The semiconductor device is provided with an IC chip 2 and the multilayered substrate 1 in which a first dielectric layer 11<SB>1</SB>on which the IC chip 2 is mounted, and a second dielectric layer 11<SB>n</SB>on which BGA balls 7 are formed are joined to each other through a ground conductor layer 12<SB>1</SB>formed to surround the forming area of signal via holes 5. In the device, the paired signal line terminals of the chip 2 is connected to a pair of BGA balls 7 through a pair of lines 4 formed on the first dielectric layer 11<SB>1</SB>and a pair of signal via holes 5 formed vertically through the multilayered substrate 1, and ground via holes 6 are formed through the ground conductor layer 12<SB>1</SB>and the second dielectric layer 11<SB>n</SB>so as to pinch the signal via holes 5. The paired lines 4 are constituted of coupled differential lines having an interval which is almost equal to that between the paired signal via holes 5. COPYRIGHT: (C)2004,JPO
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