发明名称 METHOD FOR MANUFACTURING LEADFRAME HAVING HEATSINK
摘要 PROBLEM TO BE SOLVED: To prevent reduction in the yield of material attributed to heatsink frame geometry by using a leadframe with unit leads arrayed in a plurality of lines in this method for manufacturing a leadframe having a heatsink, wherein a leadframe comprising a specified number of unit leads arrayed in a plurality of lines on a strip and a heatsink frame comprising a specified number of heatsinks arrayed in one line on a strip are used, and then heatsinks are separated from the heatsink frame for connection to the unit leads of the leadframe. SOLUTION: In the manufacturing of the leadframe having a heatsink, a plurality of connecting means 10, 20, 30 for the unit leads 1A of lines L1, L2, L3 on a leadframe 1 connect each of the heatsinks 2A on heatsink frames 2 to each of the unit leads 1A of the lines L1, L2, L3 of the lead frame 1. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004165359(A) 申请公布日期 2004.06.10
申请号 JP20020328430 申请日期 2002.11.12
申请人 MITSUI HIGH TEC INC 发明人 MIURA SHINSUKE
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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