| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed circuit board which can eliminate industrial wastes such as copper foil waste and etchant waste liquid which have been produced in large quantity, and which can remarkably shorten the manufacturing time and makes possible the limited production of diversified products. SOLUTION: The method of manufacturing the multilayer printed circuit board comprises (a) a process of printing a first-layer electric wiring circuit on an electric insulation substrate using an ink jet printer which uses ink containing conductive fine particles, (b) a process of printing an insulation layer in a part wherein the first-layer electric wiring circuit and a second-layer electric wiring circuit to be printed in the next process cross each other using an ink jet printer which uses electric insulation ink, and (c) a process of printing the second-layer electric wiring circuit using an ink jet printer which uses ink containing conductive fine particles. COPYRIGHT: (C)2004,JPO |
