| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board that can reduce the thicknesses of lines and improve the accuracy of a wiring pattern by preventing an etching margin from becoming thick as plating is performed plural times in a built-up printed wiring board in which components can be mounted on via holes and stacked via holes can also be formed. <P>SOLUTION: Since interlayer connection is obtained through bumps formed by etching copper foil, the plating performed in the conventional method for conducting via holes becomes unnecessary and the etching margin becomes thin. Consequently, the printed wiring board that can reduce the thickness of lines and improve the accuracy of the wiring pattern can be provided. <P>COPYRIGHT: (C)2004,JPO</p> |
