| 摘要 |
PURPOSE: A method for manufacturing an IC card by layering foils is provided to remove a step for digging out a groove again after layering the foils, firmly join the COB(Chip On Board) and a card plate, occur no gap between the COB and the card plate, and firmly join an electrode of the COB and an antenna. CONSTITUTION: The COB(200) is placed by facing an electrode surface of a terminal in the COB downwardly. At least more than two foils(300,400,500) having a hole(301) of the same area as the COB are layered by inserting the COB into the hole. A back side cover foil(600) having no hole is layered to an opposite side of the surface exposing the electrode surface of the terminal in the COB of the layered foils, and the foils are compressed.
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