| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin material for laminated board having high moisture resistance and soldering heat-resistance in moistened state. SOLUTION: The modified polyimide resin composition contains (A) a bismaleimide compound expressed by the general formula (R1, R2, R3 and R4 are each a≤4C alkyl; Xa, Xb, Xc and Xd are each the same or different univalent atom or group selected from hydrogen atom, halogen atom and≤3C alkyl), (B) a compound containing at least one OH group and having at least one naphthalene skeleton in the molecule and (C) an epoxy resin. COPYRIGHT: (C)2004,JPO |
