| 摘要 |
PROBLEM TO BE SOLVED: To provide a board for a plating-type printed circuit, which is high in initial adhesion to a plating layer formed on a heat-resistant film, kept high in adhesion and superior in durability under the conditions of high temperatures and humidity when it is left to stand for a long term after it is subjected to thermal loading. SOLUTION: A heat-resistant resin layer and a conductive metal layer are successively laminated on, at least, one of the surfaces of the heat-resistant insulating film for the formation of the board used for a printed circuit. The heat-resistant resin is a polyimide resin composed of an aromatic tetracarboxylic acid component and a diamine component, the polyimide resin is obtained by polymerizing a tetracarboxylic acid component that contains 60 mol% or more aromatic tetracarboxylic acid and a diamine component that contains 5 to 50 mol% siloxane diamine and 0.1 to 40 mol% diamine having an aromatic ring, and the board is characterized by the fact that the conductive metal layer contains the plating layer. COPYRIGHT: (C)2004,JPO&NCIPI |
