PRINTED CIRCUIT BOARD USING ALL LAYER INTERSTITIAL VIA HOLE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent a reduction of thickness of the board by using a material having a superior moisture absorbing property. CONSTITUTION: A printed circuit board comprises a solidified glass epoxy resin(211); a B-stage epoxy resin(213) deposited on both sides of the glass epoxy resin; and a conductive paste(219) filling the via hole penetrating through the resin. A method for manufacturing a printed circuit board comprises a step of forming an insulating substrate having five layers; a step of forming a via hole through the insulating substrate; a step of filling the via hole with a conductive paste; a step of removing a cover film from the substrate; a step of forming a conductor layer by attaching copper foils(221) on both sides of the substrate; a step of forming a photoresist pattern on the conductive layer; and a step of forming a double sided circuit board(220) by etching the conductor layer and forming a circuit pattern.