发明名称 FOAMABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a foamable resin composition capable of providing a closed cell foam foamed uniformly and at a high magnification. SOLUTION: The foamable resin composition contains thermally expandable microcapsules starting thermal expansion at a temperature not higher than 10°C above the cure initiation temperature of the resin composition. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004210981(A) 申请公布日期 2004.07.29
申请号 JP20030000540 申请日期 2003.01.06
申请人 SEKISUI CHEM CO LTD 发明人 YAMAUCHI HIROSHI;KAWAGUCHI YASUHIRO
分类号 C08J9/32;(IPC1-7):C08J9/32 主分类号 C08J9/32
代理机构 代理人
主权项
地址