发明名称 |
FOAMABLE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a foamable resin composition capable of providing a closed cell foam foamed uniformly and at a high magnification. SOLUTION: The foamable resin composition contains thermally expandable microcapsules starting thermal expansion at a temperature not higher than 10°C above the cure initiation temperature of the resin composition. COPYRIGHT: (C)2004,JPO&NCIPI |
申请公布号 |
JP2004210981(A) |
申请公布日期 |
2004.07.29 |
申请号 |
JP20030000540 |
申请日期 |
2003.01.06 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
YAMAUCHI HIROSHI;KAWAGUCHI YASUHIRO |
分类号 |
C08J9/32;(IPC1-7):C08J9/32 |
主分类号 |
C08J9/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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